SMD PCB terminal blocks with PUSH WIRE® connection technology
Push-in termination of solid conductors
Easy conductor removal via operating tool
Height of just 2.7 mm
Assemble terminal blocks without pole loss
Available in tape-and-reel packaging for automated assembly
Approvals
DEKRA Certification B.V., CCA, NTR NL-7680, EN 60947
DEKRA Certification B.V., CCA, NTR NL-7720, EN 60838
Underwriters Laboratories Inc., UL, E45171, UL 1977
DEKRA Certification B.V., CCA, 71-103560, EN 60947
DEKRA Certification B.V., KEMA/KEUR, 71-106226, EN 60838
Specifications
Notes
Note: Application notes:Suitable for lead-free, reflow-soldering profiles per DIN EN 61760-1 and IEC 60068-2-58 up to max. 260°C peak temperature. Due to application-specific variables (component configuration and orientation, type of soldering machine, solder paste), trial runs are recommended to ensure product and process compatibility under actual manufacturing conditions. || Depending on reflow soldering temperatures and times, color deviations may occur. These deviations will have no impact on functionality.
Recommendation: Recommendation for stencil:Material thickness: 150 µm; Pattern layout identical to solder pad layout